SensoHub Core Technology
| T1 | ||
| World first CCD & CMOS Hybrid TDI Technology | ||
| T2 | ||
| Ultra-large & high-resolution Area Sensor with Stitching Technology | ||
| T3 | ||
| QE maximization of UV-Vis-NIR based on BSI Technology | ||
| T4 | ||
| Radiation Hardness for Medical and Aerospace | ||
| T5 | ||
| On-Chip ADC Technology with Ultra-high speed and Wide-bandwidth Dynamic-range | ||
| T6 | ||
| Specialized Sensor Technology for various applications like One-Sensor Dual-Imaging, On-chip Dichroic CF | ||